TU2.L9: Active/Passive Microwave Remote Sensing of Terrestrial Snow II

Session Type: Oral
Time: Tuesday, July 25, 10:40 - 12:20
Location: Room 203 A
Session Chairs: Jiancheng Shi, Institute of Remote Sensing and Digital Earth, Chinese Academy of Sciences and Martti Hallikainen, Aalto University
 
10:40 - 11:00
TU2.L9.1: FUTURE MISSION CONCEPTS FOR MEASURING SNOW MASS
         Juha Lemmetyinen; Finnish Meteorological Institute
         Kimmo Rautiainen; Finnish Meteorological Institute
         Kari Luojus; Finnish Meteorological Institute
         Helmut Rott; ENVEO IT GmbH
         Thomas Nagler; ENVEO IT GmbH
         Giuseppe Parrella; German Aerospace Center (DLR)
         Irena Hajnsek; German Aerospace Center (DLR)
         Chris Derksen; Environment and Climate Change Canada
         Giovanni Macelloni; Institute of Applied Physics
         Marco Brogioni; Institute of Applied Physics
         Andreas Wiesmann; GAMMA Remote Sensing AG
         Christian M√§tzler; GAMMA Remote Sensing AG
         Michael Kern; European Space Agency (ESA)
 
11:00 - 11:20
TU2.L9.2: MICROWAVE EMISSION FROM ALPINE SNOW: EXPERIMENTAL DATA AND ELECTROMAGNETIC MODELS
         Emanuele Santi; IFAC-CNR
         Simone Pettinato; IFAC-CNR
         Simonetta Paloscia; IFAC-CNR
         Paolo Pampaloni; IFAC-CNR
         Enrico Palchetti; IFAC-CNR
         Chuan Xiong; RADI-CAS
         Andrea Crepaz; Avalanche Center, Arabba, Italy
 
11:20 - 11:40
TU2.L9.3: MICROWAVE BRIGHTNESS TEMPERATURE OF SNOW ON TERRAIN AND LAKE ICE REVISITED: DATA AND SIMULATIONS
         Martti Hallikainen; Aalto University
 
11:40 - 12:00
TU2.L9.4: FULL WAVE SIMULATION OF SNOWPACK APPLIED TO MICROWAVE REMOTE SENSING OF SEA ICE
         Shurun Tan; University of Michigan
         Jiyue Zhu; University of Michigan
         Leung Tsang; University of Michigan
         Son Nghiem; California Institute of Technology
 
12:00 - 12:20
TU2.L9.5: SNOWPACK TIME-SERIES GROUND TRUTH VIA A LOW-POWER DATALOGGER
         Roger De Roo; University of Michigan
         Steve Rogacki; University of Michigan
         Eric Haengel; Leidos, Inc.
         Chandler Ekins; University of Michigan